PRODUCTION FLOW
CHIP ON BOARD
In 1998, Hip Fung became involved in chip-on-board technology. Since then, customers’ demand for this technology has increased dramatically and that led us to dedicating a significant portion of our manufacturing space to COB products. Since the production environment in the wire-bonding process is critical to eliminating defects that can be caused by humidity, dust, static, or temperature variations, our COB facilities are exceptionally clean, and are certified under FSE 209E 10K and 100K.
